Tender Detail
| Buyer/Seller : | Can be viewed by Subscribers | |
|---|---|
| TOI : | 93357881 |
| Requirement : |
Tender Invited For HIGH PURITY LEAD-FREE ALLOY, OFFERING LOW DROSSING, STRONG WETTING AND DURABLE JOINT STRENGTH 0.8mm , HIGH PURITY, EUTECTIC SOLDER ALLOY COMPOSED OF 63% TIN (Sn) and 37% LEAD (Pb) Quantity 15 |
| Tender description : | HIGH PURITY LEAD-FREE ALLOY, O... Quantity: 15 |
| Company Industry: | Telecommunication Services / Equipments |
Key values
| Closing date : | 03/03/2026 |
|---|---|
| Document sale date : | 01-01-1900 |
| Location : | India-Karnataka |